It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

909-37.5-2-18-2-B-0

Name: Wakefield Thermal 909-37.5-2-18-2-B-0
Brand: Wakefield Thermal
SKU: 567-901-37-2-18-2-B
Price: 5.02 EUR
Availability: OutOfStock

Images are for reference only
See Product Specifications

Mouser No:

567-901-37-2-18-2-B

Mfr. No:

909-37.5-2-18-2-B-0

Mfr.:

Wakefield Thermal

Description:

Heat Sinks Chipset Heat Sink, Pin Fin, 37mm Chip Size, 17.6mm Height, Aluminum

Datasheet:

909-37.5-2-18-2-B-0 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Wakefield Thermal 909-37.5-2-18-2-B-0

Availability

Stock:: Non-Stocked

An unexpected error occurred. Please try again later.
Factory Lead Time:: Request Delivery Quote

Enter Quantity:

Minimum: 180 Multiples: 45

Unit Price:

-,-- €

Ext. Price:

-,-- €

Est. Tariff:

This Product Ships FREE

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	5,02 €	903,60 €
	4,67 €	1.260,90 €

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Wakefield Thermal
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	Component, 37mm
Mounting Style:	Clip
Heatsink Material:	Aluminum
Fin Style:	Pin Fin
Brand:	Wakefield Thermal
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TW
Product Type:	Heat Sinks
Series:	900
Factory Pack Quantity:	45
Subcategory:	Heat Sinks
Type:	Component

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

909-37.5-2-18-2-B-0 Datasheet (PDF)

Images

RoHS Certificate (PDF)

ECCN:: EAR99

900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.