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909-37-1-23-2-B-0

Name: Wakefield Thermal 909-37-1-23-2-B-0
Brand: Wakefield Thermal
SKU: 567-909371232B0
Price: 8.05 EUR
Availability: OutOfStock

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Mouser No:

567-909371232B0

Mfr. No:

909-37-1-23-2-B-0

Mfr.:

Wakefield Thermal

Description:

Heat Sinks Chipset Heat Sink with Clip, Elliptical Fin, 37mm Chip Size, 22.6mm H, Aluminum

Datasheet:

909-37-1-23-2-B-0 Datasheet (PDF)

ECAD Model:

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Learn more about Wakefield Thermal 909-37-1-23-2-B-0

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 16 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 300 Multiples: 300

Unit Price:

-,-- €

Ext. Price:

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Est. Tariff:

This Product Ships FREE

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	8,05 €	2.415,00 €
	7,73 €	4.638,00 €
	7,44 €	8.928,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Wakefield Thermal
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	Component, 37mm
Mounting Style:	Clip
Heatsink Material:	Aluminum
Brand:	Wakefield Thermal
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TW
Product Type:	Heat Sinks
Series:	900
Factory Pack Quantity:	300
Subcategory:	Heat Sinks
Type:	Component

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Datasheet

909-37-1-23-2-B-0 Datasheet (PDF)

Images

RoHS Certificate (PDF)

USHTS:: 8473302000
ECCN:: EAR99

900 Series Elliptical Fin Heat Sinks

Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. Wakefield Thermal 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.