TLSR9218AER

Telink
141-TLSR9218A
TLSR9218AER

Mfr.:

Description:
RF System on a Chip - SoC Multi-protocol Connectivity SoC, 1MB Flash, temp -40? to 85?, 48 Pin Bluetooth LE 5.2, Bluetooth Mesh, AoA/AoD, 6LoWPAN/Thread, 802.15.4, Zigbee, HomeKit, Find My, Matter, 2.4G Proprietary, RTOS PSA Level 1 Certified

Datasheet:
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Learn more about Telink TLSR9218AER

In Stock: 2.752

Stock:
2.752 Can Dispatch Immediately
Quantities greater than 2752 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
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Ext. Price:
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Pricing (EUR)

Qty. Unit Price
Ext. Price
5,92 € 5,92 €
4,34 € 43,40 €
4,05 € 101,25 €
3,56 € 356,00 €
3,38 € 845,00 €
3,04 € 1.520,00 €
2,55 € 2.550,00 €
2,44 € 7.320,00 €

Product Attribute Attribute Value Select Attribute
Telink
Product Category: RF System on a Chip - SoC
Bluetooth, Zigbee
RISC
2.4 GHz
2 Mbps
10 dBm
- 92.5 dBm
1.8 V
4.3 V
6.1 mA
6.6 mA
1 MB
- 40 C
+ 85 C
QFN-48
ADC Resolution: 14 bit
Brand: Telink
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Data Bus Width: 32 bit
Data RAM Size: 64 kB
Data RAM Type: SRAM
Height: 0.8 mm
Interface Type: I2C, I2S, SPI, UART, USB
Length: 6.1 mm
Maximum Clock Frequency: 32 MHz
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Number of ADC Channels: 9 Channel
Number of I/Os: 32 I/O
Number of Timers: 2 x 32 bit
Product Type: RF System on a Chip - SoC
Factory Pack Quantity: 3000
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
Width: 6.1 mm
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Attributes selected: 0

Datasheet

CNHTS:
8542319090
USHTS:
8542310070
ECCN:
EAR99

TLSR9218 Multi-Standard Wireless SoC

Telink TLSR9218 Multi-Standard Wireless SoC supports standards and industrial alliance specifications including BLUETOOTH® 5.2, and BLUETOOTH® LE indoor positioning. The SoC also supports BLE Mesh, Zigbee 3.0, HomeKit, 6LoWPAN, Thread, Matter, and 2.4GHz proprietary standards. The TLSR9218 combines the features and functions needed for high-quality wireless IoT equipment into a single SoC. The TLSR9218 is designed to offer high integration, and ultra-low power application capabilities.

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