917804-3

TE Connectivity
571-917804-3
917804-3

Mfr.:

Description:
Headers & Wire Housings TAB 16-14 AWG 30 AU

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
31 Weeks Estimated factory production time.
Long lead time reported on this product.
Minimum: 6000   Multiples: 6000
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
1,87 € 11.220,00 €

Alternative Packaging

Mfr. Part No.:
Packaging:
Reel, Cut Tape
Availability:
In Stock
Price:
3,29 €
Min:
1

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Headers & Wire Housings
RoHS:  
Contacts
D-5000
DYNAMIC SERIES
Component-to-Wire, Power, Signal
16 AWG to 14 AWG
Bulk
Brand: TE Connectivity
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Product Type: Headers & Wire Housings
Factory Pack Quantity: 500
Subcategory: Headers & Wire Housings
Products found:
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Attributes selected: 0

TARIC:
8538909999
CNHTS:
8538900000
CAHTS:
8536690090
USHTS:
8536698000
JPHTS:
853669000
KRHTS:
8536699000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

Dynamic Series Ruggedized Connectors

TE Connectivity's Dynamic Series Ruggedized Connectors are designed for use in control systems and in a wide range of applications requiring high-density, signal, and power. The series features a ruggedized, industrialized package that provides connector solutions ranging from signal-level circuitry to power circuit connectivity. The portfolio includes wire-to-board, wire-to-panel, and wire-to-wire connectors with a diverse range of housings. Standard crimp and spring clamp variations of parts are available. The standardized contacts limit the amount of application tooling required. A centralized wiring system saves time and costs by offering a modular capability that allows for expansion as needed. Typical applications for TE Dynamic Series Ruggedized Connectors include industrial control, Human Machine Interface (HMI), data communication, robotics, power distribution, and more.