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2376821-1

Name: TE Connectivity 2376821-1
Brand: TE Connectivity
SKU: 571-2376821-1
Price: 71.48 EUR
Availability: OutOfStock

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Mouser No:

571-2376821-1

Mfr. No:

2376821-1

Mfr.:

TE Connectivity

Description:

IC & Component Sockets LGA7529 BACKPLATE ASSY,SHORT STUD

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

2376821-1 Datasheet

ECAD Model:

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More Information

Learn more about TE Connectivity 2376821-1

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 15 Weeks Estimated factory production time.

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Minimum: 1600 Multiples: 1600

Unit Price:

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Ext. Price:

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Est. Tariff:

This Product Ships FREE

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	71,48 €	114.368,00 €
3.200	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	IC & Component Sockets
RoHS:
Product:	Accessories
Number of Positions:	7529 Position
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 100 C
Series:	LGA7529
Packaging:	Tray
Accessory Type:	Backplate
Brand:	TE Connectivity
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Housing Material:	Polyester (PE)
Product Type:	IC & Component Sockets
Factory Pack Quantity:	8
Subcategory:	IC & Component Sockets

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Datasheet

2376821-1 Datasheet

TARIC:: 8536901000
USHTS:: 8473302000
ECCN:: EAR99

LGA7529 Socket & Hardware

TE Connectivity's (TE) LGA7529 Socket and Hardware include a socket for next-generation server processors, providing more connections between the motherboard and the processor. This socket features 7529 pins, delivering increased performance and data bandwidth to support top processor multi-core architecture and high-throughput workloads. Reliable and easy installation is provided by these products, which are qualified and tested for durability and environmental resistance, including vibration and shock. LGA7529 hardware includes back plates, bolster plates, carriers, and socket covers. TE LGA7529 Socket and Hardware are suitable for networking equipment, Cloud service, servers, switches, edge computing, hyperscale, and artificial intelligence (AI).