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2057419-3

Name: TE Connectivity 2057419-3
Brand: TE Connectivity
SKU: 571-2057419-3
Price: 8.26 EUR
Availability: InStock

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Mouser No:

571-2057419-3

Mfr. No:

2057419-3

Mfr.:

TE Connectivity

Description:

High Speed/Modular Connectors IMP100 S H V2P10C LT-GUIDE OPEN-WALL

Datasheet:

2057419-3 Datasheet

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Learn more about TE Connectivity 2057419-3

In Stock: 342

Stock:: 342 Can Dispatch Immediately

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Factory Lead Time:: 11 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 342 will be subject to minimum order requirements.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	8,26 €	8,26 €
	7,05 €	70,50 €
	6,40 €	121,60 €
	6,22 €	354,54 €
	5,92 €	674,88 €
	5,57 €	1.481,62 €
	5,02 €	2.575,26 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	60 Position
Number of Rows:	6 Row
Pitch:	1.9 mm
Termination Style:	Press Fit
Contact Plating:	Gold
Series:	IMPACT Backplane
Brand:	TE Connectivity
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	750 mA
Housing Colour:	Black
Housing Material:	Liquid Crystal Polymer (LCP)
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	19
Subcategory:	Backplane Connectors
Voltage Rating:	120 V

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Datasheet

2057419-3 Datasheet

Images

RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

IMPACT™ High Density Backplane Connectors

TE Connectivity's IMPACT™ Connector System meets the increased speed and density requirements of future system upgrades and next generation data networking and telecommunications equipment. TE's IMPACT High Density Backplane Connectors feature unique broad-edge coupled design which utilizes low impedance and a localized ground return path in an optimized differential pair array. The differential pairs are tightly coupled at 80 pairs per linear inch, and are surrounded by ground structures to isolate the pairs. This innovative design enables the IMPACT High Density Backplane Connectors to achieve data rates up to 25Gb/s, reduce crosstalk, and improve overall bandwidth performance with minimal performance variance. The IMPACT High Density Backplane Connectors offered by TE are ideally suited for high speed, backplane applications such as switches, servers/blade servers, storage, and routers.