B72540T0040M062

TDK
871-B72540T40M62
B72540T0040M062

Mfr.:

Description:
Varistors Chip Varistors / Ceramic Transient Voltage Suppressors, Maximum continuous voltage=5.5V, Maximum Clamping Voltage (8/20 s)=17V

Datasheet:
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Product Attribute Attribute Value Select Attribute
TDK
Product Category: Varistors
Delivery Restriction:
 Mouser does not presently sell this product in your region.
RoHS:  
Automotive with Load Dump and Jump Start
MLVs
PCB Mount
SMD/SMT
2220 (5750 metric)
4 VAC
5.5 VDC
8 V
17 V
1 kA
1.4 J
0.024 uF
- 55 C
+ 125 C
Reel
Cut Tape
Brand: TDK
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: HR
Height: 2.5 mm
Length: 5.7 mm
Product Type: Varistors
Factory Pack Quantity: 1500
Subcategory: Varistors
Tolerance: 20 %
Type: Ceramic Transient Voltage Suppressor
Width: 5 mm
Part # Aliases: B72540T40M62
Unit Weight: 450 mg
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Attributes selected: 0

Datasheet

Models

TARIC:
8533409000
CNHTS:
8533400000
CAHTS:
8533400000
USHTS:
8533408070
JPHTS:
853340000
KRHTS:
8533409000
BRHTS:
85334012
ECCN:
EAR99

CT Multilayer Varistors

EPCOS CT Series Multilayer Varistors offer surge current up to 1200A, bidirectional protection, no derating up to +125ºC, and fast response (<0.5ns). EPCOS CT Series Multilayer Varistors are suitable for lead-free soldering and are RoHS-compatible. Applications include ESD protection in mobile phones, cordless phones, accessories, data bus applications, control electronics, detectors and sensors, touch screens, plug-in cards, and remote controls.

Ceramic Transient Varistors

TDK EPCOS Ceramic Transient Varistors feature very low capacitance range of 0.6 to 10pF and bidirectional ESD protection in one component. These devices exhibit no change in ESD protection performance at temperatures and ESD protection to IEC 61000-4-2, level 4. The Ceramic Transient Varistors offer up to 85°C (temperature derating), low parasitic inductance, low leakage current, and <0.5ns fast response time. Applications include industrial, mobile phones, consumer electronics, and interfaces.

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