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HDTM-6-08-1-S-VT-1-1

Name: Samtec HDTM-6-08-1-S-VT-1-1
Brand: Samtec
SKU: 200-HDTM6081SVT11
Price: 13.48 EUR
Availability: InStock

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Mouser No:

200-HDTM6081SVT11

Mfr. No:

HDTM-6-08-1-S-VT-1-1

Mfr.:

Samtec

Description:

High Speed/Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

HDTM-6-08-1-S-VT-1-1 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-6-08-1-S-VT-1-1

Availability

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7.278 Can Dispatch in 10 Days

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	13,48 €	13,48 €
	12,49 €	124,90 €
	11,49 €	287,25 €
	9,98 €	958,08 €
	9,22 €	2.655,36 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Packaging:	Tray
Brand:	Samtec
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	48
Subcategory:	Backplane Connectors

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Datasheet

HDTM-6-08-1-S-VT-1-1 Datasheet (PDF)

Models

HDTM-6-08-1-S-VT-1-1 Symbol & Footprint by SnapMagic

Conflict Material Declaration (Spreadsheet)

USHTS:: 8536694040
ECCN:: EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.