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HDTM-3-08-2-S-VT-2-1

Images are for reference only
See Product Specifications

Mouser No:

200-HDTM3082SVT21

Mfr. No:

HDTM-3-08-2-S-VT-2-1

Mfr.:

Samtec

Description:

High Speed / Modular Connectors XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

Datasheet:

HDTM-3-08-2-S-VT-2-1 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec HDTM-3-08-2-S-VT-2-1

Delivery Restriction:

Mouser does not presently sell this product in your region.

Availability

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	High Speed/Modular Connectors
Delivery Restriction:	Mouser does not presently sell this product in your region.
Packaging:	Tray
Brand:	Samtec
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	54
Subcategory:	Backplane Connectors

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Datasheet

HDTM-3-08-2-S-VT-2-1 Datasheet (PDF)

Technical Resources

Dimensional Drawing, Footprint, and Part Number Configuration

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.