DA-T268-301E

Ohmite
588-DA-T268-301E
DA-T268-301E

Mfr.:

Description:
Heat Sinks HEATSINK FOR TO-268

Lifecycle:
Factory Special Order:
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Datasheet:
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Product Attribute Attribute Value Select Attribute
Ohmite
Product Category: Heat Sinks
RoHS:  
Heat Sinks
D3Pak (TO-268)
SMD/SMT
Aluminum
Extruded Axial Fin
40.2 mm
12.7 mm
11.6 mm
Brand: Ohmite
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Packaging: Bulk
Product Type: Heat Sinks
Series: D
Factory Pack Quantity: 20
Subcategory: Heat Sinks
Type: Component
Unit Weight: 7,152 g
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Attributes selected: 0

Datasheet

PCN

TARIC:
7604291090
CNHTS:
7616991090
USHTS:
8541900080
ECCN:
EAR99

Heat Sinkable Resistors

Ohmite offers resistors in all popular heat sinkable packages, from TO-220 through SOT-227 and in power ratings from 35W to 200W. Ohmite also supplies multiple designs in multiple constructions, including wire wound and thick film with resistance values from 0.0005MΩ to 4MΩ. Power ratings up to 2KW with proper heat sinking are also available.

Heatsinks

Ohmite Heatsinks are engineered to take advantage of thermal transfer, reliability, and design flexibility. This heat sink product line utilizes a patented clip system that provides constant spring force over repeated assembly and disassembly. The elimination of mounting hardware reduces costs and enables a maximum surface area per unit design. Ohmite Heatsinks are designed to secure TO-126, TO-218, TO-220, TO-247, and TO-264 packages as well as provide thermal solutions for TO-252, TO-263, and TO-268 SMD devices.

Ohmite Heatsinks

Ohmite Heatsinks have been designed to take advantage of thermal transfer, reliability, and design flexibility. Ohmite's heatsink product line utilizes a patented Matrix Clip system that provides constant spring force over repeated assembly and disassembly. The elimination of mounting hardware reduces costs and enables a maximum surface area per unit design. Ohmite heatsinks are designed to secure TO-126, TO-218, TO-220, TO-247, and TO-264 packages, plus provide thermal solutions for TO-252, TO-263, and TO-268 SMD devices.
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D Series Heatsinks

Ohmite D Series Heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The heatsinks offer a low cost, large surface area, and a small footprint that can dissipate more heat. The unique patent-pending design combines tin-plated, solderable rods with an aluminum extruded heat sink body. These rods (or “rollers”) are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet. Specifically designed for use with the increasingly popular TO-252, TO-263, and TO-268 packages, the D Series affords the user superior thermal performance over the more common stamped aluminum heatsinks. By eliminating the staking joint typically used in stamped heatsinks, the resulting air gap and thermal “bottle-neck” is also eliminated, while the surface area for cooling is maximized with the extruded fins of the D Series body.

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