90156-0170

Molex
538-90156-0170
90156-0170

Mfr.:

Description:
Headers & Wire Housings C-Grid Crp Conn Hsg Hsg SR FL Polz 30Ckt

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 2400   Multiples: 1200
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,568 € 1.363,20 €
0,557 € 3.342,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Wire Housings
Receptacle Housing
30 Position
2.54 mm (0.1 in)
1 Row
Cable Mount / Free Hanging
Crimp
Socket (Female)
90156
C-Grid
- 55 C
+ 105 C
Bulk
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: ID
Current Rating: 3 A
Housing Colour: Black
Housing Material: Polyphenylene Oxide (PPO)
Product Type: Headers & Wire Housings
Factory Pack Quantity: 1200
Subcategory: Headers & Wire Housings
Part # Aliases: 0901560170
Unit Weight: 2,240 g
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Attributes selected: 0

TARIC:
8538909999
CNHTS:
8538900000
CAHTS:
8538903900
USHTS:
8538906000
JPHTS:
853890000
BRHTS:
85389090
ECCN:
EAR99

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.