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87979-0406

Name: Molex 87979-0406
Brand: Molex
SKU: 538-87979-0406
Price: 0.43 EUR
Availability: InStock

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Mouser No:

538-87979-0406

Mfr. No:

87979-0406

Mfr.:

Molex

Description:

Headers & Wire Housings MGRID DRDW RA SMT HDR. 4CKT

Datasheet:

87979-0406 Datasheet

ECAD Model:

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In Stock: 1.785

Stock:: 1.785 Can Dispatch Immediately

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	0,439 €	0,44 €
	0,372 €	3,72 €
	0,327 €	8,18 €
	0,289 €	28,90 €
	0,26 €	78,00 €
	0,211 €	253,20 €
	0,198 €	534,60 €
	0,179 €	912,90 €
	0,17 €	1.734,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	Breakaway
Number of Positions:	4 Position
Pitch:	2 mm (0.079 in)
Number of Rows:	2 Row
Row Spacing:	2 mm (0.079 in)
Mounting Style:	SMD/SMT
Termination Style:	Solder
Mounting Angle:	Right Angle
Contact Gender:	Pin (Male)
Contact Plating:	Tin
Series:	87979
Tradename:	Milli-Grid
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Tray
Brand:	Molex
Contact Material:	Copper Alloy
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	ID
Current Rating:	2 A
Flammability Rating:	UL 94 V-0
Housing Colour:	Black
Housing Material:	Nylon
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	1
Subcategory:	Headers & Wire Housings
Voltage Rating:	125 V
Part # Aliases:	0879790406
Unit Weight:	129 mg

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Datasheet

87979-0406 Datasheet

Models

RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

MolexFamMilliGrid

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.