76015-3403

Name: Molex 76015-3403
Brand: Molex
SKU: 538-76015-3403
Price: 17.71 EUR
Availability: InStock

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Mouser No:

538-76015-3403

Mfr. No:

76015-3403

Mfr.:

Molex

Description:

High Speed/Modular Connectors I-TRAC BP ASSY - 4 C Y - 4 COL GUIDE LEFT

Datasheet:

76015-3403 Datasheet

ECAD Model:

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In Stock: 300

Stock:: 300

Can Dispatch Immediately

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On Order:: 298
Factory Lead Time:: 33

Weeks Estimated factory production time for quantities greater than shown.

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Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	17,71 €	17,71 €
	15,05 €	150,50 €
	14,11 €	352,75 €
	13,43 €	671,50 €
	12,99 €	1.299,00 €
	12,26 €	3.678,00 €
	11,91 €	7.146,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	56 Position
Number of Rows:	7 Row
Pitch:	3.7 mm
Termination Style:	Solder Pin
Contact Plating:	Gold
Series:	76015
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	MY
Current Rating:	1 A
Housing Material:	Thermoplastic (TP)
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	300
Subcategory:	Backplane Connectors
Tradename:	GbX I-Trac
Voltage Rating:	120 VAC/DC
Part # Aliases:	0760153403
Unit Weight:	5,157 g

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Datasheet

76015-3403 Datasheet

Models

PCN

RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

GbX I-Trac Backplane Connector System

The GbX I-Trac Vertical Header Backplane Connector System achieves superior impedance control and 12.5Gbps data rates in high-bandwidth applications. The connectors feature a unique open pin-field design, offering flexibility to assign high-speed differential pairs, low-speed signals, and power/ground contacts anywhere within the pin field.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.