75784-0140

Molex
538-75784-0140
75784-0140

Mfr.:

Description:
High Speed/Modular Connectors iPass(TM) Vt 2.79TH TH Univ 0.38Au 36Ckt

Lifecycle:
Restricted Availability:
This part number is not currently available from Mouser. Product may be in limited distribution or a factory special order.
ECAD Model:
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In Stock: 3

Stock:
3 Can Dispatch Immediately
Quantities greater than 3 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 140)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
10,43 € 10,43 €
8,87 € 88,70 €
8,32 € 208,00 €
7,73 € 386,50 €
Full Reel (Order in multiples of 140)
7,23 € 1.012,20 €
7,22 € 2.021,60 €
7,07 € 2.969,40 €
6,58 € 6.448,40 €
2.380 Quote
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Molex
Product Category: High Speed/Modular Connectors
RoHS:  
Receptacles
36 Position
2 Row
0.8 mm
Solder
Gold
75784
Reel
Cut Tape
MouseReel
Brand: Molex
Contact Material: Tin
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 500 mA
Housing Material: Thermoplastic
Maximum Operating Temperature: + 80 C
Minimum Operating Temperature: - 40 C
Mounting Angle: Vertical
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 140
Subcategory: Backplane Connectors
Tradename: iPass
Voltage Rating: 30 V
Part # Aliases: 0757840140
Unit Weight: 4 g
Products found:
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Attributes selected: 0

TARIC:
8536693000
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.