55917-2830

Molex
538-55917-2830
55917-2830

Mfr.:

Description:
Headers & Wire Housings 2.0 WtB Dual ConnDip PlgHsgAssy28CktGreen

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 3200   Multiples: 1600
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
1,82 € 5.824,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Headers
Shrouded
28 Position
2 mm (0.079 in)
2 Row
5 mm (0.197 in)
Through Hole
Solder Pin
Straight
Pin (Male)
Tin
55917
MicroClasp
Wire-to-Board
- 25 C
+ 85 C
Tray
Brand: Molex
Contact Material: Tin
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: Not Available
Current Rating: 3 A
Flammability Rating: UL 94 V-0
Housing Colour: Natural
Housing Material: Polyester
Product Type: Headers & Wire Housings
Factory Pack Quantity: 80
Subcategory: Headers & Wire Housings
Voltage Rating: 250 V
Part # Aliases: 0559172830
Unit Weight: 2 g
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Attributes selected: 0

TARIC:
8536699099
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.

MolexFamMicroClasp


MicroClasp Wire-to-Board Connector System

Molex MicroClasp Wire-to-Board Connector System provides space savings and easy mating/unmating compared to similar 2.00 and 2.50mm pitch wire-to-board systems. MicroClasp includes a unique inner positive lock that provides latch protection, secure retention, and an audible mating "click". The terminal design offers low insertion and withdrawal forces and is able to carry 3.0A current in a compact 2.00mm pitch design. Molex MicroClasp system is available in 2-40 circuits in SMT and through-hole designs, and in single- and dual-row versions.