173359-0002

Molex
538-173359-0002
173359-0002

Mfr.:

Description:
I/O Connectors zCD SB Style 1 .75mm W/O GSKT & EMIFGRS

ECAD Model:
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In Stock: 72

Stock:
72
Can Dispatch Immediately
On Order:
72
Factory Lead Time:
51
Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 72 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
72,32 € 72,32 €
64,49 € 644,90 €
62,01 € 1.550,25 €
58,40 € 2.920,00 €
56,84 € 5.684,00 €
250 Quote

Product Attribute Attribute Value Select Attribute
Molex
Product Category: I/O Connectors
RoHS:  
I/O Connectors
Female
120 Position
0.75 mm
30 V
Gold
PCB Mount
Through Hole
Right Angle
173359
- 40 C
+ 85 C
Brand: Molex
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 1 A
Flammability Rating: UL 94 V-0
Housing Material: Thermoplastic (TP)
Number of Ports: 1 Port
Product Type: I/O Connectors
Factory Pack Quantity: 675
Subcategory: I/O Connectors
Part # Aliases: 01733590002
Products found:
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Attributes selected: 0

TARIC:
8536693000
CNHTS:
8536690000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

zCD Interconnect System Connector

Molex zCD Interconnect System Connector supports 400Gbps Ethernet applications and transmits 400GBps data rates (25GBps per serial lane) with excellent signal integrity (SI), Electro-Magnetic Interference (EMI) protection, and thermal cooling. The zCD connector is a press-fit connector the ensures a robust and simple board termination. The Molex zCD connector is designed to accept a broad range of customer-specified thermal modules and heat sinks and provides excellent thermal management.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.