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171335-5807

Name: Molex 171335-5807
Brand: Molex
SKU: 538-171335-5807
Price: 18.47 EUR
Availability: OutOfStock

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Mouser No:

538-171335-5807

Mfr. No:

171335-5807

Mfr.:

Molex

Description:

High Speed/Modular Connectors IMPEL 1.9MM 3X8 VRT BKPLN RIGHT GUID OPN

Datasheet:

171335-5807 Datasheet

ECAD Model:

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More Information

Learn more about Molex 171335-5807

Availability

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	18,47 €	7.092,48 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Number of Positions:	48 Position
Number of Rows:	6 Row
Pitch:	1.9 mm
Contact Plating:	Gold
Series:	171335
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	SG
Current Rating:	750 mA
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	384
Subcategory:	Backplane Connectors
Tradename:	Impel
Voltage Rating:	150 VAC/DC
Unit Weight:	6,755 g

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Datasheet

171335-5807 Datasheet

Models

PCN

Global Change Notification (PDF)

RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

Impel Backplane Interconnect System

Molex Impel Backplane Connector System achieves signal integrity, density, and data rates up to 40Gbps while enabling backward and forward compatibility. A compact, compliant-pin backplane connector enables backward and forward compatibility with various high-end architectures. 92Ω nominal impendence minimizes impedance discontinuities and multiple pitch options are available for design flexibility. The connectors deliver superior density and electrical performance, low crosstalk, low insertion loss, and minimal performance variations across all channels and frequencies to 20GHz. Molex Impel applications include telecommunications, data networking, industrial, and military/aerospace.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

Impel & Impel Plus Backplane Interconnect System

Molex Impel Backplane Interconnect System delivers industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements.