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Mfr.	Mfr. No:	Qty	Ext Total

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346-11-106-41-013000

Mill-Max

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Mouser No:

575-3461110641013000

Mfr. No:

346-11-106-41-013000

Mfr.:

Mill-Max

Description:

IC & Component Sockets Interconnect Socket

Datasheet:

346-11-106-41-013000 Datasheet

ECAD Model:

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In Stock: 480

Stock:: 480 Can Dispatch Immediately

An unexpected error occurred. Please try again later.
Factory Lead Time:: 2 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 480 will be subject to minimum order requirements.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

-,-- €

Ext. Price:

-,-- €

Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	5,19 €	5,19 €
	4,73 €	47,30 €
	4,48 €	112,00 €
	4,36 €	148,24 €
	4,15 €	423,30 €
	3,67 €	998,24 €
	3,20 €	3.264,00 €
	2,68 €	6.742,88 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Mill-Max
Product Category:	IC & Component Sockets
RoHS:
Series:	0346
Packaging:	Bulk
Brand:	Mill-Max
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	IC & Component Sockets
Factory Pack Quantity:	34
Subcategory:	IC & Component Sockets

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Datasheet

346-11-106-41-013000 Datasheet

RoHS, RoHS-2, and RoHS-3 Compliance Statement (PDF)

TARIC:: 8536901000
CAHTS:: 8536900020
USHTS:: 8536694040
JPHTS:: 8536900002
BRHTS:: 85369090
ECCN:: EAR99

FEATURED PRODUCTS

MILL-MAX

835 Horizontal Surface-Mount Sockets

.100" grid horizontal sockets with removable high-temperature insulators for low-profile connections

Pin Receptacles

Board level connectors provide flexibility, quality, and reliability for critical applications.

Low-Profile Interconnect Sockets

2.11mm above-board height single- and double-row sockets for minimizing interconnect height.

.050” (1.27 mm) Pitch Solder Cup Headers & Sockets

A highly reliable interconnect in a compact format, designed for easy wire-to-board connections.

Discrete Insulated Pins & Receptacles

Fitted with cylindrical insulating sleeves for electrical isolation applications.