ATWINC3400A-MU-Y

Microchip Technology
556-ATWINC3400A-MU-Y
ATWINC3400A-MU-Y

Mfr.:

Description:
RF System on a Chip - SoC SmartConnect Chipset (WINC3400)
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Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 490   Multiples: 490
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
6,62 € 3.243,80 €

Product Attribute Attribute Value Select Attribute
Microchip
Product Category: RF System on a Chip - SoC
RoHS:  
Bluetooth
APS3
2.4 GHz
72.2 Mbps
18.3 dBm
- 71 dBm
2.7 V
4.2 V
63.9 mA
275 mA
256 kB
- 40 C
+ 85 C
VQFN-48
Brand: Microchip Technology
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: KR
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Product Type: RF System on a Chip - SoC
Series: ATWINC3400
Factory Pack Quantity: 490
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
Unit Weight: 2,497 g
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Attributes selected: 0

Datasheet

DTS

PCN

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CNHTS:
8542310000
CAHTS:
8542310000
USHTS:
8542390090
MXHTS:
8542310302
ECCN:
5A992.C

Connected (Wired & Wireless)

Microchip Technology Connectivity is easy to add to applications, as Microchip's MCUs and MPUs are designed to be compatible with Microchip wired and wireless devices. Robust, reliable, high-speed connectivity is available with a broad portfolio of wired connectivity solutions. Mobility, convenience, and enhanced user experience are possible with a wide range of wireless connectivity solutions. And, with pre-certified modules, designers can avoid worrying about communication regulations.‌

Wireless Connectivity

Microchip Technology Wireless Connectivity Solutions enable you to quickly incorporate connectivity into your designs with wireless ICs, modules, software, and development kits that make connecting effortless for your customers. Microchip's comprehensive wireless portfolio has the technology to meet your range, data rate, interoperability, frequency, and topology needs. Microchip Technology's fully certified modules enable drop-in wireless connectivity, saving development costs and reducing time to market.

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