M80-4032642

Harwin
855-M80-4032642
M80-4032642

Mfr.:

Description:
Headers & Wire Housings Datamate J-Tek 13+13 POS VERT MALE W/101 HARDWARE

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 33

Stock:
33 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
19,31 € 19,31 €
16,95 € 118,65 €
16,14 € 451,92 €
15,37 € 860,72 €
14,71 € 1.544,55 €
13,82 € 3.482,64 €
13,51 € 6.809,04 €

Product Attribute Attribute Value Select Attribute
Harwin
Product Category: Headers & Wire Housings
RoHS:  
Headers
26 Position
2 mm (0.079 in)
2 Row
PCB Mount
Solder Pin
Straight
Gold
J-Tek
Datamate
Tube
Brand: Harwin
Contact Material: Brass
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: GB
Flammability Rating: UL 94 V-0
Housing Colour: Black
Housing Gender: Female
Housing Material: Polyphenylene Sulfide (PPS)
Product Type: Headers & Wire Housings
Factory Pack Quantity: 7
Subcategory: Headers & Wire Housings
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TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

Datamate PIHR Throughboard Connectors

Harwin Datamate Pin-in-Hole Reflow (PIHR) Throughboard Connectors are available in two variants: 2- to 3-position single-row with a secure latched fixing format (L-Tek) and 4- to 50-position double-row with a robust jackscrew fixing (J-Tek). These connectors are designed with resilient, low-frequency contacts optimized for reliable signal integrity. The PIHR-compatible contacts enable automated throughboard reflow assembly processes without compromising mechanical retention to the PCB. Additional features include flame-retardant, glass-filled UL 94V-0 housing and stainless-steel jackscrews for enhanced durability under vibration and temperature extremes. Harwin PIHR connectors are ideal for aerospace, oil and gas, military, and robotics applications.