2518127007Y3

Fair-Rite
623-2518127007Y3
2518127007Y3

Mfr.:

Description:
Ferrite Beads MultLyr Chip Bead 70 OHM 1812 3000mA

Datasheet:
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Learn more about Fair-Rite 2518127007Y3

In Stock: 6.569

Stock:
6.569 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 1000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,482 € 0,48 €
0,337 € 3,37 €
0,291 € 7,28 €
0,26 € 13,00 €
0,23 € 23,00 €
0,178 € 44,50 €
0,167 € 83,50 €
Full Reel (Order in multiples of 1000)
0,148 € 148,00 €
0,143 € 286,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fair-Rite
Product Category: Ferrite Beads
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
1812 (4532 metric)
70 Ohms
3 A
25 %
40 mOhms
- 55 C
+ 125 C
4.5 mm
3.2 mm
1.5 mm
Reel
Cut Tape
MouseReel
Brand: Fair-Rite
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Ferrite Beads
Shielding: Unshielded
Factory Pack Quantity: 1000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Multilayer Ferrite Chip Bead
Part # Aliases: 2518127007Y3L
Unit Weight: 27 mg
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Attributes selected: 0

Datasheet

TARIC:
8504509590
CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
MXHTS:
85049099
ECCN:
EAR99

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.

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