572-003-420-301

EDAC
587-572-003-420-301
572-003-420-301

Mfr.:

Description:
Pin & Socket Connectors 572 Series Wire to Wire / Wire to Board 5.8mm pitch connector with 3 board mount contacts, male board mount, blue

ECAD Model:
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In Stock: 10

Stock:
10 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
1,94 € 1,94 €
1,70 € 17,00 €
1,51 € 37,75 €
1,44 € 144,00 €
1,26 € 315,00 €
1,02 € 510,00 €

Product Attribute Attribute Value Select Attribute
EDAC
Product Category: Pin & Socket Connectors
RoHS:  
572
E-Seal Waterproof Connectors
Brand: EDAC
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Product Type: Pin & Socket Connectors
Factory Pack Quantity: 500
Subcategory: Pin & Socket Connectors
Unit Weight: 3 g
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Attributes selected: 0

TARIC:
8536699099
CNHTS:
8538900000
CAHTS:
8536690040
USHTS:
8536694030
JPHTS:
853669000
KRHTS:
8536699000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

E-Seal Waterproof Connectors

EDAC E-Seal Waterproof Connectors use a unique epoxy sealing process that seals the entire back of the connector rather than at the individual pins. This produces a complete seal with a smooth finish and guarantees no water ingress up to IP67 standards. The E-Seal system offers a full range of D-subs from DB 9 to a maximum of 78 positions. Standard and high-density footprints are available in vertical or right angle orientations. EDAC E-Seal Waterproof Connectors plating options vary from gold flash to 30u” of gold and include a wide variety of mounting options.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.