566-003-000-710

EDAC
587-566-003-000-710
566-003-000-710

Mfr.:

Description:
Pin & Socket Connectors 566 Series Wire to Wire / Wire to Board 2.0mm pitch connector with 3 contact spaces, male, black, Wire Insulation oe1.00 to oe1.25

ECAD Model:
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In Stock: 83

Stock:
83 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
4,70 € 4,70 €
4,27 € 42,70 €
4,05 € 101,25 €
3,96 € 198,00 €
3,77 € 377,00 €
3,29 € 822,50 €
3,20 € 1.600,00 €
2,73 € 2.730,00 €
2,54 € 6.350,00 €

Product Attribute Attribute Value Select Attribute
EDAC
Product Category: Pin & Socket Connectors
RoHS:  
Receptacle Housings
3 Position
1 Row
2 mm
Crimp
Free Hanging
Polybutylene Terephthalate (PBT)
250 V
566
Brand: EDAC
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Product Type: Pin & Socket Connectors
Factory Pack Quantity: 250
Subcategory: Pin & Socket Connectors
Unit Weight: 563 mg
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Attributes selected: 0

TARIC:
8538909999
CNHTS:
8538900000
CAHTS:
8538903900
USHTS:
8538908180
JPHTS:
853890000
BRHTS:
85389090
ECCN:
EAR99

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.