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560-002-000-111

Name: EDAC 560-002-000-111
Brand: EDAC
SKU: 587-560-002-000-111
Price: 1.22 EUR
Availability: InStock

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Mouser No:

587-560-002-000-111

Mfr. No:

560-002-000-111

Mfr.:

EDAC

Description:

Pin & Socket Connectors 560 Series Wire to Wire / Wire to Board 2.5mm pitch connector with 2 contact spaces, male, white

Datasheet:

560-002-000-111 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about EDAC 560-002-000-111

In Stock: 93

Stock:: 93 Can Dispatch Immediately

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	1,22 €	1,22 €
	1,07 €	10,70 €
	1,02 €	25,50 €
	0,877 €	87,70 €
	0,743 €	185,75 €
	0,662 €	331,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	EDAC
Product Category:	Pin & Socket Connectors
RoHS:
Product:	Plug Housings
Number of Positions:	2 Position
Number of Rows:	1 Row
Pitch:	2.5 mm
Termination Style:	Crimp
Mounting Style:	Free Hanging
Housing Material:	Silicon Rubber
Voltage Rating:	250 V
Series:	560
Brand:	EDAC
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	Pin & Socket Connectors
Factory Pack Quantity:	500
Subcategory:	Pin & Socket Connectors
Unit Weight:	1,300 g

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Attributes selected: 0

Filter Document:

TARIC:: 8536699099
CNHTS:: 8538900000
CAHTS:: 8536690040
USHTS:: 8536694030
JPHTS:: 853669000
KRHTS:: 8536699000
BRHTS:: 85366990
ECCN:: EAR99

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.