14L-292-482

EDAC
587-14L-292-482
14L-292-482

Mfr.:

Description:
Headers & Wire Housings 14L Series Inline Tin plated Socket Contact. For 22-18AWG wire, use for socket housing only

ECAD Model:
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In Stock: 8.430

Stock:
8.430 Can Dispatch Immediately
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,086 € 0,09 €
0,065 € 0,65 €
0,058 € 1,45 €
0,056 € 5,60 €
0,05 € 12,50 €
0,047 € 47,00 €
Full Reel (Order in multiples of 3000)
0,045 € 135,00 €
0,04 € 240,00 €
0,039 € 351,00 €

Product Attribute Attribute Value Select Attribute
EDAC
Product Category: Headers & Wire Housings
RoHS:  
Accessories
1 Position
Cable Mount / Free Hanging
Crimp
Straight
Socket (Female)
Tin
14L
22 AWG to 18 AWG
- 25 C
+ 105 C
Reel
Cut Tape
Accessory Type: In-Line Socket Contact
Brand: EDAC
Contact Material: Phosphor Bronze
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 7 A
Flammability Rating: UL 94 V-0
Insulation Resistance: 1 GOhms
Product Type: Headers & Wire Housings
Factory Pack Quantity: 3000
Subcategory: Headers & Wire Housings
Voltage Rating: 250 VAC/DC
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TARIC:
8536901000
CAHTS:
8536900020
USHTS:
8536904000
JPHTS:
853690000
MXHTS:
8536902800
ECCN:
EAR99

14L Series 3.96mm Inline Wire-to-Board Connectors

EDAC 14L Series 3.96mm Inline Wire-to-Board Connectors feature a 3.96mm pitch, 7A current rating, and an operating temperature range of -25°C to +105°C. The insulator material has a UL 94V-0 flammability rating and top- or side-entry configurations. 14L series connectors accept 22AWG to 18AWG wires and offer a 1500VAC dielectric withstanding voltage, 1000MΩ insulation resistance, and 10mΩ maximum contact resistance. EDAC 14L Series 3.96mm Inline Wire-to-Board Connectors are for use with PCB boards of 1.6mm nominal thicknesses.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.