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TGP 40000SF-0.040-00-0606

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Mouser No:

951-TGP400SF.0400066

Mfr. No:

TGP 40000SF-0.040-00-0606

Mfr.:

Bergquist Company

Description:

Thermal Interface Products GAP PAD, Sil-Free, 40W/m-K, 6x6" Sheet, 0.040" Thickness, Thermexit, IDH 2972782

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

TGP 40000SF-0.040-00-0606 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Bergquist Company TGP 40000SF-0.040-00-0606

Delivery Restriction:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Bergquist Company
Product Category:	Thermal Interface Products
Delivery Restriction:	Mouser does not presently sell this product in your region.
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Thermal Pad
Package/Case:	Non-standard
Material:	Silicone-Free Polymer
Thermal Conductivity:	40 W/m-K
Color:	Black
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 150 C
Length:	152.4 mm
Width:	152.4 mm
Thickness:	1.016 mm
Series:	TGP 40000SF
Brand:	Bergquist Company
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Designed for:	Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
Product Type:	Thermal Interface Products
Size:	6 in x 6 in
Factory Pack Quantity:	1000
Subcategory:	Thermal Management
Tradename:	GAP PAD / Thermexit
Part # Aliases:	TGP 40000SF-0.040-00-0606-NA 2972782
Unit Weight:	23 g

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Datasheet

TGP 40000SF-0.040-00-0606 Datasheet (PDF)

Application Notes

Application Note: Handling and Converting Guide - Berqquist GAP PAD TGP 40000SF 6 Inch Sheets (PDF)

Images

MSDS

Safety Data Sheet (PDF)

Product Catalogs

Technical Resources

Product Presentation (PDF)

USHTS:: 3921905050
ECCN:: EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.