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GF2000-07-60-50CC

Name: Bergquist Company GF2000-07-60-50CC
Brand: Bergquist Company
SKU: 951-GF200007-6050CC
Price: 41.62 EUR
Availability: OutOfStock

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Mouser No:

951-GF200007-6050CC

Mfr. No:

GF2000-07-60-50CC

Mfr.:

Bergquist Company

Description:

Thermal Interface Products Liquid Gap Filler, 50CC Dual Cartridge, Gap Filler TGF 2000/2000, IDH 2179526

This product will be sent to you directly from the manufacturer. You may order this product now. Mouser will notify you of the estimated dispatch date.

Datasheet:

GF2000-07-60-50CC Datasheet (PDF)

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Availability

Stock:: 0

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Factory Lead Time:: 4 Weeks Estimated factory production time.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	41,62 €	874,02 €
	39,02 €	975,50 €
	36,41 €	1.820,50 €
	35,11 €	3.511,00 €
	33,49 €	8.372,50 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Bergquist Company
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Liquid Gap Filler
Package/Case:	Non-standard
Material:	Silicone Elastomer
Thermal Conductivity:	2.0 W/m-K
Color:	Pink, White
Minimum Operating Temperature:	- 60 C
Maximum Operating Temperature:	+ 200 C
Flammability Rating:	UL 94 V-0
Series:	2000 / TGF 2000
Brand:	Bergquist Company
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	Thermal Interface Products
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Tradename:	Gap Filler
Part # Aliases:	BG412691 L50CCW0H0D0 2179526

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Thermal Gap Fillers

Bergquist Company Thermal Gap Fillers are thermally conductive gap filling liquid materials that enhance thermal performance and enable easier dispensing application for high-volume manufacturing operations. These materials provide high thermal and mechanical performance while inducing virtually zero stress on electronic components during assembly, improving performance and reliability across device assemblies. The liquid, thermal gap filler materials self-level, fill intricate air voids, and conform to highly intricate topographies and multi-level surfaces. This allows delivery of better wet-out for optimized thermal resistance, generally lower than more solid pad-based mediums. Thixotropic qualities also mean the gap fillers hold shape when dispensed.