5419 1/2"

3M Electronic Specialty
517-5419-1/2
5419 1/2"

Mfr.:

Description:
Adhesive Tapes POLYIMIDE 1/2X36YD

In Stock: 175

Stock:
175 Can Dispatch Immediately
Factory Lead Time:
2 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
59,70 € 59,70 €
54,62 € 546,20 €
39,42 € 709,56 €
37,01 € 1.998,54 €
36,61 € 3.953,88 €
34,74 € 8.754,48 €

Product Attribute Attribute Value Select Attribute
3M
Product Category: Adhesive Tapes
RoHS:  
Tapes
Low Static Polyimide Film Tape
Low Static Polyimide Film Tape Series 5419
Gold
Polyimide (PI)
Silicone
12.7 mm
0.5 in
12.7 mm
36 yd
32.92 m
Brand: 3M Electronic Specialty
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Product Type: Tape
Series: 5419
Factory Pack Quantity: 18
Subcategory: Supplies
Tensile Strength: 578 N/100 mm
Thickness: 0.07 mm
Part # Aliases: 02120030226 70016048913 7000125230
Unit Weight: 55,729 g
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Attributes selected: 0

CNHTS:
3919109900
USHTS:
3919102055
KRHTS:
3919100000
MXHTS:
3919100100
ECCN:
EAR99

Polyimide Film Protection Tapes

3M Electronic Specialty Polyimide Film Protection Tapes are advanced temperature-resistant tapes for protecting electronic and electrical components during fabrication and in use. These tapes help improve productivity and device reliability while providing dielectric protection. Used for a variety of applications requiring temporary or permanent holding, 3M Polyimide Film Protection Tapes are engineered to provide reliable performance under high temperatures and other harsh environmental conditions.

Polyimide Film Tape: Series 5419

3M´s low static Polyimide Film Tape is a translucent, polyimide film-backed silicone adhesive tape with extremely low electrostatic discharge properties. The polyimide film does not soften at elevated temperatures, providing an excellent release surface. The tape can be used as a mask for printed circuit boards during wave solder or solder dip process and as a release surface in fabrication of parts cured at elevated temperatures.