10380-3280-000-0

3M Electronic Solutions Division
517-10380-3280-0000
10380-3280-000-0

Mfr.:

Description:
D-Sub Backshells 80P SHLD JUNC SHELL

ECAD Model:
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In Stock: 563

Stock:
563 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
11,39 € 11,39 €
9,68 € 96,80 €
9,07 € 181,40 €
8,64 € 432,00 €
8,23 € 823,00 €
7,71 € 1.542,00 €
7,14 € 7.140,00 €

Product Attribute Attribute Value Select Attribute
3M
Product Category: D-Sub Backshells
RoHS:  
Two Piece Backshell
Straight
1 Entry
Steel
Nickel
80 Position
Each
Brand: 3M Electronic Solutions Division
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Flammability Rating: UL 94 V-0
Product Type: D-Sub Backshells
Series: 103
Factory Pack Quantity: 100
Subcategory: D-Sub Connectors
Part # Aliases: 90169009303 7000007398 JE150187449
Unit Weight: 30,800 g
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TARIC:
8538909999
CNHTS:
8538900000
CAHTS:
8538909090
USHTS:
8538908180
JPHTS:
853890000
BRHTS:
85389090
ECCN:
EAR99

MDR Accessories

3M offers a range of EMI/RFI  D-Sub Backshells in a variety of materials to accommodate pin counts from 14 to 100, thru-hole, surface mount and press fit mounting styles, IDC and solder termination versions, and multiple connector orientations.

High-Density I/O Connectors & Assemblies

3M High-Density I/O Connectors and Assemblies are based on the long-established Delta Ribbon Centronics®-style Mini Delta Ribbon (MDR) System. The Mini Delta Ribbon (MDR) Connectors are a half-pitch interconnect system designed to meet the needs of high-speed/density I/O applications. The MDR system offers a proven solution that provides shielding against EMI/ESD and reliable connection through the pre-loaded ribbon contacts, as well as 0.050" centerlines. The MDR connectors and assemblies allow mass termination through IDC U-shaped contacts and offer a wide range of pin counts and form factors to enable design flexibility.